publications &

patents

journal articles

 

1. L. Breziner, P. Strahs, P. Hutapea, “Influence of Vibration on the Liquid Water Transport of PEM Fuel Cells,” Journal of Power Sources, submitted, 2009.

2. W. S. Slovinsky, P. Hutapea, “The Influence of Bolting Parameters on the Failure Mechanisms of Fiber-reinforced Composite-Metal Joints,” Mechanics Based Design of Structures and Machines, in press, 2009.

3. Y. Luo, P. Hutapea, “Design of Bone Transport Devices using Smart Material Actuators,” Journal of Mechanical Design, 131(9), 091005, September 2009.

4. K. Jacobs, M. Harper, E. Meyer, B. Roth, P. Hutapea, “Development of a Proof-of-Concept Smart Aircraft Control,” Aeronautical Journal. 113(1147), pp. 587-590, September 2009.

5. Y. Luo, P. Hutapea, “Stress-Strain Behavior of a Smart Magnetostrictive Actuator for a Bone Transport Device,” Journal of Medical Devices, 2(4), 2008.

6. L. Breziner, P. Hutapea, “Influence of Harsh Environmental Conditions on CFRP-Aluminum Single Lap Joints,” Aircraft Engineering and Aerospace Technology, 80(4), pp. 371-377, 2008.

7. P. Hutapea, J. Kim, A. Guion, C. Hanna, N. Heulitt, “Development of a Smart Wing,” Aircraft Engineering and Aerospace Technology, 80(4), pp. 439-444, 2008.

8. M. Smith, P. Hutapea, “Optimizing Adhesively Bonded Metal-Composite Hybrid Joints,” Journal of Ship Production, 23(2), pp. 72-81, 2007.

9. P. Hutapea, J. L. Grenestedt, “Modifying Electric Artworks to Improve Dimensional Stability of Microelectronic Substrates,” Microelectronics International, 24(1), pp. 15-22, 2007.

10. P. Hutapea, J. L. Grenestedt, M. Modi, M. Mello, K. Frutschy, “Prediction of Microelectronic Substrate Warpage Using Homogenized Finite Element Models,” Microelectronic Engineering, 83(3), pp. 557 – 569, 2006.

11. W. J. Shakespeare, R. A. Pearson, J. L. Grenestedt, P. Hutapea, V. Gupta, “MEMS Integrated Submount Alignment for Optoelectronics,” Journal of Lightwave Technology, 23(2), pp. 504-509, 2005.

12. P. Hutapea, J. L. Grenestedt, “Reducing Warpage of Printed Circuit Boards using Wavy Traces,” Journal of Electronic Packaging, 126(3), pp. 282-287, 2004.

13. P. Hutapea, F. G. Yuan, N. J. Pagano, “Microstress Prediction in Composite Laminates with High Stress Gradients,” International Journal of Solids and Structures, 40(9), pp. 2215-2248, 2003.

14. J. L. Grenestedt, P. Hutapea, “Influence of Electric Artwork on Thermomechanical Properties and Warpage of Printed Circuit Boards,” Journal of Applied Physics, 94(1), pp. 686-696, 2003.

15. P. Hutapea, J. L. Grenestedt, “Effect of Temperature on Elastic Properties of Woven Glass/Epoxy Substrates for Printed Circuit Board Applications,” Journal of Electronic Materials, 32(4), pp. 221-227, 2003.

16. J. L. Grenestedt, P. Hutapea, “Using Waviness to Reduce Thermal Warpage in Printed Circuit Boards,” Applied Physics Letters, 81(21), pp. 4079-4081, 2002.

17. P. Hutapea, P. Qiao, “Determination of Micropolar In-plane Shear and Rotation Moduli of Unidirectional Fiber Composites with Fiber-Matrix Interfacial Debonding,” Journal of Composite Materials, 36(11), pp. 1381-1400, 2002.

18. P. Hutapea, F. G. Yuan, “The Effect of Thermal Aging on the Mode-I Interlaminar Fracture Behavior of High-Temperature IM7/LaRC-RP46 Composites,” Composites Science and Technology, 59, pp. 1271-1286, 1999.

 

refereed proceedings

 

1. L. Breziner, P. Strahs, P. Hutapea, “Effect of Vibrations on the Liquid Water Transport of Polymer Electrolyte Fuel Cells,” ASME 7th Annual Fuel Cell Science, Engineering & Technology Conference, Newport Beach, California, June 8-10, 2009.

2. P. Hutapea, “Magnetostrictive Actuator for a Bone Transport Device,” ASME SMASIS, Ellicott City, MD, October 28-30, 2008.

3. L. Breziner, P. Hutapea, “PEM Fuel Cell Scooter,” ASME 6th Annual Fuel Cell Science, Engineering & Technology Conference, Denver, Colorado, June 16-18, 2008.

4. Y. Luo, P. Hutapea, “Design of a Smart Bone Lengthening Device for Children,” ASME Design of Medical Devices Conference , Minneapolis, Minnesota, April 15-17, 2008.

5. W. S. Slovinsky, P. Hutapea, “The Influence of Bolting Parameters on the Failure Mechanisms of Fiber-reinforced Composite-Metal Joints,” Cancom 2007, Winnipeg, Manitoba, Canada, August 15 - 17, 2007.

6. W. S. Slovinsky, P. Hutapea, “The Influence of Bolting Parameters on the Failure Mechanisms of Fiber-reinforced Composite-Metal Joints,” 18th ASCE Engineering Mechanics Conference, Virginia Tech, Blacksburg, Virginia, June 3 - 6, 2007.

7. L. Breziner, P. Hutapea, “The Influence of Harsh Environmental Conditions on the Failure Mechanisms of Carbon Fiber-reinforced Composite-Metal Joints,” 18th ASCE Engineering Mechanics Conference, Virginia Tech, Blacksburg, Virginia, June 3 - 6, 2007.

8. Y. Luo, P. Hutapea, “A Bone Lengthening Device for Children,” 18th ASCE Engineering Mechanics Conference, Virginia Tech, Blacksburg, Virginia, June 3 - 6, 2007.

9. P. Hutapea, “Improving the Dimensional Stability of Electronic Substrates Influenced by Temperature and Moisture,”  IMECE2005, ASME International Mechanical Engineering Conference and Exposition, Orlando, Florida, 2005.

10. P. Hutapea, J. L. Grenestedt, M. Modi, M. Mello, K. Frutschy, “Prediction of CPU Substrate Warpage Using Homogenized Thermomechanical Finite Element Models,” ASME Interpack05, San Francisco, California, July 17-22, 2005.

11. A. Shugar, M. Notis, L. Limata, D. N. Wong, P. Hutapea, H. Rubin, “Early Chinese Scissors and Shears: Category, Design and Shape: A Metallurgical Study,” 4th International Symposium on Archaeometry, 3-7 May 2004, Zaragoza, Spain.

12. P. Hutapea, J. L. Grenestedt, “Tuning Electric Artworks of Printed Circuit Boards to Reduce Warpage,” 9^th International Symposium and Exhibition on Advanced Packaging Materials, IEEE CPMT, Atlanta, Georgia, 2004. Best Paper Award

13. P. Hutapea, F. G. Yuan, N. J. Pagano, “Microstress Prediction in Composite Laminates with High Stress Gradients,” Proceedings of the American Society for Composites (ASC) 17th Technical Conference, West Lafayette, Indiana, October 2002.

14. P. Hutapea, F. G. Yuan, “Mode-I Fracture Toughness of IM7/LaRC-RP46 Composites Under Thermal Aging,” 39thAIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, Long Beach, California, 1998.

 

abstracts & presentations

 

1. L. Breziner, P. Hutapea, “Influence of Vibration on the Water Transport of PEM Fuel Cells,” AIAA/ASME 4th Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2008.

2. Y. Luo, P. Hutapea, “Development of a Bone Lengthening Device for Children,” AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2007.

3. P. Hutapea, J. Kim, A. Guion, C. Hanna, N. Heulitt, “Development of a Smart Wing,” AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2007.

4. W. S. Slovinsky, P. Hutapea, “The Influence of Bolting Parameters on the Failure Mechanisms of Fiber-reinforced Composite-Metal Joints,” AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2007.

5. L. Breziner, P. Hutapea, “The Influence of Harsh Environmental Conditions on the Failure Mechanisms of Carbon Fiber-reinforced Composite-Metal Joints,” AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2007.

6. M. Smith, P. Hutapea, “Optimizing Adhesively Bonded Metal-Composite Hybrid Joints,” AIAA/ASME 2nd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2006.

7. P. Hutapea, M. El-Mougharbel, “Reducing Anisotropy to Improve the Dimensional Stability of Composite Laminates,” AIAA/ASME 2nd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2006.

8. P. Hutapea, B., Bogicevic, “Reliability of Surface Mount Technology Packages,”   AIAA/ASME 2nd Annual Aerospace/Mechanical Engineering Symposium, Philadelphia, Pennsylvania, 2006.

9. J. L. Grenestedt, P. Hutapea, “Dimensional Stability Modeling and Measurements,” Lehigh University Center for Optical Technology Seminar, Bethlehem, Pennsylvania, November 11, 2004.

10. W. J. Shakespeare, R. A. Pearson, J. L. Grenestedt, P. Hutapea, V. Gupta, “MEMS Integrated Submount Alignment for Optoelectronics,” International Microelectronics and Packaging Society (IMAPS) Optoelectronics Device Packaging Topical Workshop and Exhibition, Bethlehem, Pennsylvania, October 11-14, 2004.

11.  J. L. Grenestedt, P. Hutapea, “Optimization Techniques for Reducing Warpage of Unpopulated Organic Substrates,” International Microelectronics and Packaging Society (IMAPS) Optoelectronics Device Packaging Topical Workshop and Exhibition, Bethlehem, Pennsylvania, October 11-14, 2004.

12. J. L. Grenestedt, P. Hutapea, “Dimensional Stability of Optoelectronic Packages,” Lehigh University Center for Optical Technologies Fall Symposium, Bethlehem, Pennsylvania, November 10, 2003.

13. J. L. Grenestedt, P. Hutapea, K. Frutschy, “Prediction of CPU Substrate Warpage using a Combined Homogenization and Finite Element Method,” Mechanics and Materials Conference, Scottsdale, Arizona, June 17 - 20, 2003.

14. J. L. Grenestedt, P. Hutapea, “Tuning Organic Substrates for Improving Reliability,” International Microelectronics and Packaging Society (IMAPS) Conference on Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS), Northampton County Community College, Allentown, Pennsylvania, June 5, 2003. Best Paper Award

15. P. Hutapea, J. L. Grenestedt, “Warpage of Printed Circuit Boards,” International Microelectronics and Packaging Society (IMAPS) Conference on Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS), Bethlehem, Pennsylvania, October 21-23, 2002.

16. P. Hutapea, J. Wang, P. Graham, E. Setiawan, “A Teleoperated Mobile Robocrane: Testbed For Control Algorithm Verification,” International Society for Computers and Applications (ISCA) 11th International Conference, pp. 7-10, San Francisco, California, 1996.

17. J. Wang, P. Graham, P. Hutapea, E. Setiawan, G. K. Lee, “A Mobile Manipulator System Using the Robocrane,” International Society for Computers and Applications (ISCA) 10th International Conference, pp. 298-302, Indianapolis, Indiana, 1995.

18. P. Hutapea, P. Graham, E. Setiawan, J. Wang, “A Mobile Manipulator System using the Robocrane: A Testbed for Control Algorithm and System Integration Studies,” AIAA Southeastern Regional Student Conference, Atlanta, Georgia, 1995.

 

 

 

Parsaoran Hutapea, Ph.D.

Temple University

Composites Laboratory, Room 208

Department of Mechanical Engineering

1947 N. 12th Street

Philadelphia, PA 19122

Phone: 215-204-5113 or 7805

E-mail: hutapea@temple.edu

contact:

composites laboratory